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FOR MANUFACTURING INDUSTRIES IN SRI LANKA ->> www.systematic7.com (with Easy Payments And Customisation) production | Manufacturing | industry | technical terms | Zone | chemical | industry | BOI | www.systematic7.com | software system covers | ERP | Application | App | ERP | software package | monitor | electrical | electronic 35) Field Programmable Gate Array [Acronym: FPGA] Field-programmable gate arrays (FPGAs) are integrated circuits that can be programmed in the field after manufacture. They’re used by engineers in the design of specialized integrated circuits that can later be produced and hard-wired in large quantities. They consist of an array of logic elements, flip-flops and programmable interconnect wiring. 36) Fine Pitch Technology [Acronym: FPT] Fine Pitch technology is an technology related to surface mount components that contain interconnections whose pitch is on the order of 0.2 to 0.65 mm. H 37) Hot Air Solder Leveling [Acronym: HASL] Hot air solder leveling is a finish used on printed circuit boards. The boards are dipped into a bath of molten solder, covering them completely. 38) High Density Interconnect [Acronym: HDI] High density interconnects are printed circuit boards with higher wiring density per unit than more conventional printed circuit boards, making them lighter and smaller with enhanced electrical performance. I 39) In Circuit Test [Acronym: ICT] In Circuit Tests involve the testing of a populated circuit board by an electrical probe, ensuring that there are no shorts, opens, resistance, capacitance. Generally, it is done to confirm that the assembly was fabricated correctly. 40) Insulated-Gate Bipolar Transistor [Acronym: IGBT] An Insulated Gate Bipolar Transistor is a minority-carrier device with high input impedance and large bipolar current-carrying capability. 41) Integrated Passive Device [Acronym: IPD] Integrated Passive Devices are fabricated using standard wafer fab technologies such as thin film and photolithography processing. IPDs can be designed as flip chip mountable or wire bondable components and the substrates for IPDs usually are thin film substrates like silicon, alumina or glass. IPD technology offers the ideal trade-off for system in package integration. L 42) Lead Bonding [Acronym: LB] Lead Bonding is the joining of metallic parts to form an electrically conductive path that will ensure electrical continuity and the capacity to conduct any current to be present in a safe manner. 43) Lead Frame [Acronym: LF] A lead frame is a common type of chip package utilizing metal leads, and providing external terminals and mechanical support to align them. This metal structure carries electrical signals from the die to the outside. 44) Laser Direct Imaging [Acronym: LDI] Laser direct imaging support the digital printed circuit board production process. Computer control operated, LDI can write patterns onto high sensitivity resists. They provide high resolution results with easy processing. 45) Liquid Photo Imageable [LPI] Liquid Photo Imageable is a liquid ink comprised of two components mixed together just before application, resulting in a coating that adheres to printed circuit board surfaces. It’s designed primarily for spray, screenprint and curtain coat applications. M 46) Multi Chip Module [Acronym: MCM] A multi-chip module is an electronic package consisting of multiple integrated circuits assembled into a single device. MCMs work as a single component and are capable of handling entire functions. Reducing the size of devices, they’re encapsulated by plastic molding and mounted onto circuit boards. 47) Metal Electrode Leadless Face [Acronym: MELF] Metal electrode leadless face is a type of leadless cylindrical electronic surface mount device that is metallized at its ends. MELF devices are usually resistors and diodes. 48) Molded Interconnection Device [Acronym: MID] Molded interconnect devices are merge the circuit board, housing, connectors, and cables that comprise traditional product interfaces into fully functional, compact parts. These 3-dimensional electromechanical parts bring together mechanical and electrical engineering. 49) Metal Oxide Semiconductor Field Effect Transistor [Acronym: MOSFET] A Metal-Oxide Semiconductor Field-Effect Transistor is a special type of field-effect transistor that works by electronically varying the width of a channel along which charge carriers flow. Charge carriers enter the channel at the source, and exit via the drain. The width of the channel is controlled by the voltage on an electrode called the gate that’s located between the source and the drain, and insulated from the channel by an extremely thin layer of metal oxide. O 50) Organic Solderability Protective [Acronym: OSP] Organic solderability preservative is a method for coating of printed circuit boards. OSP uses a water-based organic compound that selectively bonds to copper and protects it until soldering. Compounds typically used in OSPs are from the azole family. P 51) Passive Electronic Components There are two classes of electronic components – Active and Passive. Passive components are electronic components that don’t require a source of energy to perform their intended functions. Such component types don’t have the ability to control currents by means of another electrical signal. Examples of passive component types include resistors, capacitors, inductors, and diodes. 52) Plastic Leaded Chip Carrier [Acronym: P-LCC] A Plastic Leaded Chip Carrier is a square surface mount chip package in plastic with pins on all four sides. 53) Plastic Quad Flat Pack [Acronym: P-QFP] A Plastic Quad Flat Pack is a type of integrated circuit packaging technology that allows gull wing pins to extend from all four sides of the body. 54) Plastic Small Outline [Acronym: P-SO] Plastic Small Outlines include JEDEC standard compliance, footprint and height 50% of DIP, two side leaded for routing simplicity, 50 mil (1.27 mm) pitch for SMT simplicity, and gull wing formed leads for improved surface mount technology manufacturing. 55) Plastic Thin Small Outline Package [Acronym: P-TSOP] Plastic Thin Small Outline Packages are a type of surface mount integrated circuit package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm), frequently used for RAM and Flash memory ICs. They have a high pin count and are small volume. 56) Printed Circuit Board [Acronym: PCB] A printed circuit board is an electronic circuit consisting of thin strips of conducting material such as copper. Integrated circuits and other components are attached to this flat insulating sheet. 57) Plated Through Hole [Acronym: PTH] Through-hole technology refers to a mounting scheme involving the use of leads on components inserted into holes drilled into printed circuit boards and soldered to pads on the opposite side either by manual assembly or with the use of automated insertion mount machines. Q 58)Quad Flat No-Leads [Acronym: QNF] Quad Flat No-Leads physically and electrically connect integrated circuits to printed circuit boards. 59) Quad Flat Pack [Acronym: QFP] A quad flat package is a surface mount integrated circuit package with gull wing leads extending from its four sides. Socketing such packages is rare. Through-hole mounting of this package is not possible. R 60) Resin Coated Copper [Acronym: RCC] Resin-Coated-Copper films can be laminated on assembled chips and components, providing the polymer dielectric matrix for further 3D package processing. S 61) Single Inline Package [Acronym: SIP] A single inline package is a computer chip package that contains only a single row of connection pins. This is different from dual inline packages, which have two rows of connected pins. 62) System In a Package [Acronym: SiP] A System In A Package is a number of integrated circuits enclosed in a single module. The SiP performs all or most of the functions of an electronic system, and is typically used inside of mobile phones and digital music players. 63) Single Inline Memory Module [Acronym: SIMM] A single in-line memory module (SIMM) is a module containing one or several random access memory (RAM) chips on a small circuit board with pins that connect to the computer motherboard. 64) Surface Insulation Resistance [Acronym: SIR] Surface Insulation Resistance is the electrical resistance of an insulating material between a pair of contacts, conductors, or grounding devices, which is determined under specific environmental and electrical conditions. 65) Surface Mount Device [Acronym: SMD] A surface mount device is an electronic device made by producing electronic circuits where components are mounted directly onto the surface of printed circuit boards. 66) Surface Mount Technology [Acronym: SMT] Surface-mount technology is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards. 67) System On a Chip [Acronym: SOC] A system-on-a-chip is a microchip with all the necessary electronic circuits and parts for a given system, such as a smartphone or wearable computer, on a single integrated circuit. 68) Small Outline Diode [Acronym: SOD] Small Outline Diode is a designation for a group of semiconductor packages for surface mounted diodes. 69) Small Outline Dual Inline Memory Module [Acronym: SODIMM] A small outline dual in-line memory module is a type of computer memory built using integrated circuits. SO-DIMMs are a smaller alternative to DIMMs, roughly half the size of regular DIMMs. 70) Small Outline Integrated Circuit [Acronym: SOIC] A Small Outline Integrated Circuit is a surface-mounted integrated circuit package that occupies an area about 30–50% less than equivalent dual in-line packages, and with 70% less thickness typically. They are generally available in the same pin-outs as their counterpart dual in-line package integrated circuits. 71) Small Outline J-Lead [Acronym: SOJ] A Small Outline J-Lead integrated circuit is a surface mount component that contains j-style pins on either side of the body. 72) Statistical Process Control [Acronym: SPC] Statistical Process Control is an industry-standard methodology for measuring and controlling quality during the manufacturing process. Quality data in the form of product or process measurements are obtained in real-time during manufacturing. This data is then plotted on a graph with pre-determined control limits. Control limits are determined by the capability of the process, whereas specification limits are determined by the client’s needs. 73) Shrink Small Outline Package [Acronym: SSOP] Shrink small outline package chips have gull wing leads protruding from two long sides, and a lead spacing of 0.0256 inches (0.65mm). 0.5mm lead spacing is less common, but not rare. T 74) Tape Automated Bonding [Acronym: TAB] Tape-automated bonding is a process that places bare integrated circuits onto a printed circuit board by attaching them to fine conductors in a polyamide or polyimide film. This provides a means to directly connect to external circuits. 75) Tape Carrier Package [Acronym: TCP] The Tape Carrier Package component consists of the device interconnected to a 3 layer tape automated bonding tape. The interconnects are copper. The tape carrier film is polyimide. An advanced epoxy-based adhesive system is used. 76) Through Hole Mounting [Acronym: THM] Through-hole mounting is the process by which component leads are placed into drilled holes on a bare printed circuit board. This process was standard until the rise of surface mount technology in the 1980s. Despite its drop in popularity, through-hole technology is still used within niche applications due to its reliability. 77) Transistor Outline [Acronym: TO] Transistor Outline packages are stamped, coined or drawn metal components with standard dimensional outlines commonly used in the semiconductor industry for the hermetic packaging of integrated circuits. 78) Thin Small Outline Package [Acronym: TSOP] A type of surface mount integrated circuit package, a Thin Small Outline Package is a rectangular, thin bodied component. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM and Flash memory integrated circuits due to their high pin count and small volume. Z 79) Zero Insertion Force [Acronym: ZIF] Zero insertion force is a type of integrated circuit socket or electrical connector that requires very little force for insertion. With a ZIF socket, before the integrated circuit is inserted, a lever on the side of the socket is moved pushing all the sprung contacts apart so that the IC can be inserted with very little force. The lever is then moved back, allowing the contacts to close and grip the pins of the IC. 80) Zigzag Inline Package [Acronym: ZIP] Zig-zag in-line package is an integrated circuit encapsulated in a slab of plastic with 20 or 40 pins, measuring (for the ZIP-20 package) about 3 mm x 30 mm x 10 mm. The package’s pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05″), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a printed circuit board, with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. They’re commonly used for dynamic RAM chips.